| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for forming a multilayer wiring substrate suitable for formation of minute wiring by a semi-additive method and high in connection reliability, by a simple process. <P>SOLUTION: This method for forming a multilayer wiring substrate includes processes of: (1) forming a laminate 22 comprising an insulating resin layer 16 and a polymer glue layer 20 containing a polymer precursor having a functional group forming interaction with a plating catalyst or its precursor, and a polymerizable group on the surface of a first wiring substrate having metal wiring 14 formed on a substrate 12; (2) applying energy to a region other than a via connection part on the surface of the laminate 22 in a pattern-like form to form, on an exposed region, the pattern-like polymer glue layer 20 bound to the insulating resin layer 16; (3) applying the plating catalyst or its precursor to the pattern-like polymer glue layer 20 and carrying out first electrodeless plating to form a metal film 26 on the surface of the pattern-like polymer glue layer; and (4) forming a via 28 using the pattern-like metal film 26 as a mask and thereafter carrying out a de-smearing treatment. <P>COPYRIGHT: (C)2010,JPO&INPIT |
