| 摘要 |
An alternative substrate envelope sealing and closure system apparatus and method for same, whereby the system comprises an envelope having a segment of its back panel cut-out and replaced with a material that is more adhereable than the material of the outer surface of the envelope. The envelope lacks hot melt adhesives or peel and seal type latex adhesives. A method for sealing alternative substrate envelopes in mass quantities, whereby alternative substrate envelopes are utilized at high speeds for commercial use and insertion. A method for the large scale packing and sealing of alternative substrate envelopes, whereby the envelopes are packed and sealed using automated devices.
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