| 摘要 |
PROBLEM TO BE SOLVED: To prevent moisture intruding from a pad electrode part from spreading over a wiring pattern surface, and to improve the reliability of a semiconductor module. SOLUTION: The wiring pattern 2 of this semiconductor module is formed on an insulating substrate 1, and includes an electrode region 4c for connecting a wiring region 4a with a semiconductor device, and a boundary region 4b provided between the wiring region 4a and the electrode region 4c. A gold-plated layer 5 is provided on the surface of the electrode region 4c of the wiring pattern 2. The top surface of the wiring pattern 2 in the boundary region 4b is formed to be recessed relative to the top surface of the wiring pattern 2 in the wiring region 4a, and a stepped portion 2b is formed in the boundary region 4b. Solder resist 6 is formed to cover a part of the gold-plated layer 5 and the wiring pattern in the boundary region 4b and the wiring region 4a, and has a predetermined opening 6a for carrying out connection to the semiconductor device. A conductive member 8 is connected to the gold-plated layer 5 in the electrode region 4c, and a sealing resin layer 12 seals the whole of them. COPYRIGHT: (C)2010,JPO&INPIT |
