发明名称
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component capable of accurately forming a terminal electrode. <P>SOLUTION: In a preparation process, a rubber plate 10 where a through holding hole 11 is formed is prepared. The holding hole 11 includes a narrow part 16 and wide parts 17 and 18 lined up in a lining direction X. The dimension in the width direction Y of the wide parts 17 and 18 is larger than the dimension in the width direction Y of the narrow part 16. Then, in an insertion process, a chip element 1 is inserted from one opening 11a of the holding hole 11 so as to hold the chip element 1 by the narrow part 16 of the holding hole 11. Then, in an extrusion process, the chip element 1 inserted from one opening 11a is pushed by a press pin 20 inserted from the other opening 11b of the holding hole 11 to the wide parts 17 and 18, and an electrode formation part A in the chip element 1 is exposed from one opening 11a. In the state, in an imparting process, conductor paste is applied to the electrode formation part A of the chip element 1. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP4501981(B2) 申请公布日期 2010.07.14
申请号 JP20070249920 申请日期 2007.09.26
申请人 发明人
分类号 H01G4/30;H01C17/00;H01C17/28;H01G13/00 主分类号 H01G4/30
代理机构 代理人
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