发明名称 IMAGE SENSOR, AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an image sensor, and a method of manufacturing the same. SOLUTION: This image sensor includes: a semiconductor substrate 100 formed with readout circuits 120 on a unit pixel basis; an interlayer insulation layer 160 formed over the semiconductor substrate 100; wires 150 formed by penetrating the interlayer insulation layer 160 to be respectively connected to the readout circuits 120; and a first metal pattern formed over the interlayer insulation layer 160, a second metal pattern formed over the first metal pattern, and a photodiode pattern formed over the second metal pattern to be respectively connected to the wires 150. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010157713(A) 申请公布日期 2010.07.15
申请号 JP20090282780 申请日期 2009.12.14
申请人 DONGBU HITEK CO LTD 发明人 LEE MIN-HYUNG
分类号 H01L27/146;H01L25/065;H01L25/07;H01L25/18 主分类号 H01L27/146
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