Wafer alignment method that is independent of thickness and under-layer structure in 3-dimensional IC integration,申请号KR20080078663-传众专利搜索

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发明名称	Wafer alignment method that is independent of thickness and under-layer structure in 3-dimensional IC integration
摘要
申请公布号	KR100969947(B1)	申请公布日期	2010.07.14
申请号	KR20080078663	申请日期	2008.08.11
申请人		发明人
分类号	H01L21/027	主分类号	H01L21/027
代理机构		代理人
主权项
地址

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