| 摘要 |
<p>Provided is a thermosetting resin composition which can be used for the production of printed circuit boards, having good dielectric properties in high frequency bands so that transmission loss can be significantly lowered, having excellent heat resistance after moisture absorption and thermal expansion properties, and satisfying peeling strength between the resin composition and metal foil. The present invention relates to a thermosetting resin composition comprising a polyphenylene ether-modified butadiene prepolymer comprising a polyphenylene ether (A) and a butadiene polymer (B'), characterized in that the component (A) has a number average molecular weight in the range of 7000 to 30000; the component (B') comprises 40% or more of a unit derived from a 1,2-butadiene unit having a 1,2-vinyl group in a side chain; the component (B') is not a modified polybutadiene in which the 1,2-vinyl group in the side chain, or one or both of the terminals in the molecule of the component (B') is/are chemically modified by converting into epoxy, glycol, phenol, maleic acid, (meth)acryl, or urethane; and the component (B') has a cross-linked structure; and a resin varnish, a prepreg and a metal clad laminated board using the same.</p> |
