| 摘要 |
The present invention provides a film forming method of a uniform semiconductor layer having a large area at a low cost and equipment to form said semiconductor layer, by blowing gas against a coated layer to shorten the drying time and to decrease uneven drying. A film forming method of a semiconductor layer characterized by being provided, after a process to coat a semiconductor material containing a solvent on a substrate, with a process to blow gas against a coated layer of a semiconductor layer containing said solvent to evaporate the solvent.
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