发明名称 |
Polishing pad containing embedded liquid microelements and method of manufacturing the same |
摘要 |
A polishing pad is provided. The polishing pad includes a polishing layer composed of a polymeric matrix and liquid microelements embedded in the polymeric matrix. Open pores defined by the embedded liquid microelements are distributed across a surface of the polishing layer. Due to the microstructural open pores uniformly distributed across a surface of the polishing pad, a polishing operation can be performed at high precision. The polishing pad shows constant polishing performance during the polishing operation, can be stably used, and does not cause a wafer to be scratched. In addition, a method of manufacturing the polishing pad is provided. Since all components used to manufacture the polishing pad are in a liquid phase, manufacturing can be easily performed.
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申请公布号 |
US7754118(B2) |
申请公布日期 |
2010.07.13 |
申请号 |
US20060350951 |
申请日期 |
2006.02.10 |
申请人 |
HUH HYUN;LEE SANG-MOK;SONG KEE-CHEON;KIM SEUNG-GEUN;SON DO-KWON |
发明人 |
HUH HYUN;LEE SANG-MOK;SONG KEE-CHEON;KIM SEUNG-GEUN;SON DO-KWON |
分类号 |
B29C71/00;B24B37/20;B24B37/22;B24B37/24;B24D13/14;B24D18/00;B29B7/94;B29C70/60;C08G18/10;C08G18/32;C08G18/48;H01L21/304 |
主分类号 |
B29C71/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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