发明名称 |
HEAD PART OF LED DIE BONDER |
摘要 |
<p>PURPOSE: A head part device of an LED die bonder is provided to maintain a stable process flow by using a one body shaped casting base in order to have the durability against vibrations and deformation. CONSTITUTION: A head part comprises an epoxy device for dotting the epoxy in the pad of a lead frame which is transferred with a feeding device. The head part comprises a chip bonding device which attaches a chip to the pad of a lead frame where an epoxy dotting work is completed from the epoxy device by separating a chip from a wafer sheet. A base(500) supports the epoxy device, a chip bonding device, and a camera part. The camera part is composed of an epoxy camera(410) which detects a lead frame before the epoxy dotting and the chip attachment, a mount camera(420), and a wafer camera(430) which recognizes the chip of the wafer sheet.</p> |
申请公布号 |
KR100969531(B1) |
申请公布日期 |
2010.07.12 |
申请号 |
KR20090117818 |
申请日期 |
2009.12.01 |
申请人 |
AST CO., LTD. |
发明人 |
HWANG, TAE SANG;LEE, SUNG HEE;AHN, YONG SOO;CHO, JUNG HYUN;JUNG, SUNG MIN;PARK, SANG IL;KANG, CHUNG HWAN |
分类号 |
H01L21/58;H01L33/48 |
主分类号 |
H01L21/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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