发明名称 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
摘要 Chip capacitors are arranged in a core board for a printed wiring board. This makes it possible to reduces the distance between an IC chip and the chip capacitor and to reduce the loop inductance. The core board, which is a lamination consisting of a first resin board, a second resin board, and a third resin board, has a sufficient strength.
申请公布号 KR20100080630(A) 申请公布日期 2010.07.09
申请号 KR20107013202 申请日期 2000.09.01
申请人 IBIDEN CO., LTD. 发明人 INAGAKI YASUSHI;ASAI MOTOO;WANG DONGDONG;YABASHI HIDEO;SHIRAI SEIJI
分类号 H05K1/18;H01L21/48;H01L23/498;H01L23/50;H01L23/64;H01L25/16;H05K1/02;H05K3/42;H05K3/46 主分类号 H05K1/18
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