发明名称 METHOD FOR ATTACHING SMT STENCIL TO A SUBSTRATE
摘要 An assembly for attaching SMT stencils to a substrate, which includes: a stencil (30) having a plurality of evenly distributed holes along its periphery. The assembly further includes a frame (10) for receiving the stencil (30) and a mesh substrate, attached to the frame. A unified structure of the stencil with the mesh is formed by sewing machine, which thread through the holes of the stencil.
申请公布号 US2010170621(A1) 申请公布日期 2010.07.08
申请号 US20080663847 申请日期 2008.06.11
申请人 SHNAPS HILEL;KATZ ASAF;SASSON TSAFRIR 发明人 SHNAPS HILEL;KATZ ASAF;SASSON TSAFRIR
分类号 B29C65/72;D05B1/00;D05B81/00;D05B93/00 主分类号 B29C65/72
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