发明名称 |
METHOD FOR ATTACHING SMT STENCIL TO A SUBSTRATE |
摘要 |
An assembly for attaching SMT stencils to a substrate, which includes: a stencil (30) having a plurality of evenly distributed holes along its periphery. The assembly further includes a frame (10) for receiving the stencil (30) and a mesh substrate, attached to the frame. A unified structure of the stencil with the mesh is formed by sewing machine, which thread through the holes of the stencil.
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申请公布号 |
US2010170621(A1) |
申请公布日期 |
2010.07.08 |
申请号 |
US20080663847 |
申请日期 |
2008.06.11 |
申请人 |
SHNAPS HILEL;KATZ ASAF;SASSON TSAFRIR |
发明人 |
SHNAPS HILEL;KATZ ASAF;SASSON TSAFRIR |
分类号 |
B29C65/72;D05B1/00;D05B81/00;D05B93/00 |
主分类号 |
B29C65/72 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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