| 摘要 |
Embodiments of a semiconductor device and method provide a quad flat no-lead semiconductor package which can have an arrangement of both chip-on-lead (COL) style leads and a die pad for supporting a die, and can also provide non-COL leads, both COL leads and a leadframe power pad, COL leads which have varying lengths to reduce stress resulting from thermal mismatch between a semiconductor die and leads, and a die pad with a curved, meandering edge to reduce stress resulting from thermal mismatch between the semiconductor die and the die pad.
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