| 摘要 |
PURPOSE: A substrate punching device which can prevent the slake of a substrate in the transferring of substrate is provided to accurately punch and press a substrate using a first mold without drooping. CONSTITUTION: A substrate punching device comprises a main body(100), a first and a second molds(200,300), and a transferring unit(400). The first mold is installed on the upper part of the main body. The second mold is disposed oppositely to the first mold in a horizontal direction. The second mold compresses and stamps a substrate(10) located between the first, and the second mold. The transferring unit vertically clamps and transfers the substrate in order to be supplied to the first and the second mold without sinking the substrate. |
