| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic device having high reliability with respect to sealing properties and temperature cycles. <P>SOLUTION: In a state wherein an end 29 of a bent metal material is inserted into a through-hole 21 formed in a glass base 2, the glass base is heated and softened to join a metal material to a reverse surface of the glass base, and a sidewall of the through-hole is made to flow to be joined to a surface of the end of the metal material. Then an electronic component is mounted on a top surface of the glass base and an electrode of the electronic components is electrically connected to the metal material. <P>COPYRIGHT: (C)2010,JPO&INPIT |
