| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing apparatus of a semiconductor device capable of improving a yield of a resin sealing step using a molding die at a relatively low cost. SOLUTION: The manufacturing apparatus for manufacturing the semiconductor device from an object to be molded includes a molding die 142 which clamps the object to be molded for injection of molten resin, for molding, and an atmospheric pressure plasma processing apparatus 160 which reforms a parting surface of the molding die 142 to have hydrophobic property by atmospheric pressure plasma processing. COPYRIGHT: (C)2010,JPO&INPIT
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