| 摘要 |
<p>PURPOSE: A stacked semiconductor package is provided to clamp a connector and a second semiconductor package by using clamp unit, thereby reducing an assembly time and assembly error. CONSTITUTION: A first substrates has a first neighboring area according to a first chip area. A first semiconductor chip(120) is arranged in the first chip area of a first top side. A first semiconductor package(100) is electrically connected to the first semiconductor. A second semiconductor package is arranged on the first semiconductor package. A second substrate has a second chip area and a second neighboring area corresponding to the first chip area. A clamp unit(400) clamps a first and a second substrate.</p> |
