| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a device for cooling a semiconductor module having high cooling performance for a capacitor and capable of easily reducing a switching surge voltage. <P>SOLUTION: A semiconductor module 2 is cooled with a cooling pipe 7. The semiconductor module 2 includes a positive electrode terminal 41 and a negative electrode terminal 42 to which a DC voltage is applied. The module also includes a positive electrode side heatsink 51 and a negative electrode side heatsink 52. Further, the module includes a semiconductor device connected to the positive electrode side heatsink 51 and the negative electrode side heatsink 52, and a capacitor 6 connected electrically to the positive electrode side heatsink 51 and the negative electrode side heatsink 52 to be parallel to the semiconductor device. The positive electrode side heatsink 51 and the negative electrode side heatsink 52 radiate the heat generated from the semiconductor device during the period electric current is applied. The cooling pipe 7 is so configured as to cool the positive electrode side heatsink 51, the negative electrode side heatsink 52, and the capacitor 6. <P>COPYRIGHT: (C)2010,JPO&INPIT |
