发明名称 HEAT-INSULATING WATERPROOF STRUCTURE AND HEAT-INSULATION WATERPROOFING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a heat-insulating waterproof structure and a heat-insulation waterproofing method for a structure, in which a resin foam body having superior heat resistance is used. SOLUTION: This heat-insulating waterproof structure 1 includes a heat-insulation material 3 laminated on the substrate 2 of the structure, a fixing metal fitting 4 which has a thermally adhesive material on the surface exposed to the front surface of the heat-insulation material 3 and which is anchored to the substrate 2 to fix the heat-insulation material to the substrate 2, and a vinyl chloride resin sheet 5 which is laminated on the heat-insulation material 3 and adhered to the fixing metal fitting 4 through the thermally adhesive material. The thermally adhesive material 3 is formed by foaming a resin composition which contains a copolymer comprising aromatic vinyl units and aliphatic carboxylic acid derivative units. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010150800(A) 申请公布日期 2010.07.08
申请号 JP20080329600 申请日期 2008.12.25
申请人 KANEKA CORP 发明人 KUMAGAI TATSUO;KOBAYASHI HIROSHI;SATO TAKEISHI;TATEYAMA AI
分类号 E04D5/10;E04D5/14;E04D11/00 主分类号 E04D5/10
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