| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a water-based dispersing substance for chemical machinery polishing which has a high polishing speed and high flattening characteristics for a wiring material, a barrier metal film, and an interlayer insulating film, and a chemical machinery polishing method using the same. <P>SOLUTION: The water-based dispersing substance for chemical machinery polishing contains (A) silica particles, (B) a maleic acid and (C) a heterocyclic compound, wherein a value of pH is≥8 and <12 and the ratio (W<SB>B</SB>/W<SB>C</SB>) of the content (W<SB>B</SB>: mass%) of the (B) maleic acid and the content (W<SB>C</SB>: mass%) of the (C) heterocyclic compound is 1.5 to 100. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
