发明名称 METHOD OF MANUFACTURING SOLID-STATE IMAGING DEVICE
摘要 A method of manufacturing a solid-state imaging device. Light-receiving sensor portions each constituting a pixel in the form of a matrix is arranged. The matrix has columns aligned in a vertical direction and rows aligned in a horizontal direction. Charge-transfer portions are formed on either side of the columns of said pixels. Transfer electrodes in said charge-transfer portions are formed to include a first transfer electrode formed of a first electrode layer and a second transfer electrode formed by electrically connecting the first electrode layer and a second electrode layer through a contact. The second transfer electrode being disposed in the vertical direction above the charge-transfer portion in a vicinity of the contact to decrease the width of the charge-transfer portions in the horizontal direction and increase the light receiving sensor portions in the vertical direction.
申请公布号 US2010171857(A1) 申请公布日期 2010.07.08
申请号 US20100724259 申请日期 2010.03.15
申请人 SONY CORPORATION 发明人 KANBE HIDEO
分类号 H01L27/148;H01L21/28;H01L27/146;H01L29/04;H04N5/335;H04N5/341;H04N5/355;H04N5/369;H04N5/372 主分类号 H01L27/148
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