发明名称 |
METHOD OF MANUFACTURING SOLID-STATE IMAGING DEVICE |
摘要 |
A method of manufacturing a solid-state imaging device. Light-receiving sensor portions each constituting a pixel in the form of a matrix is arranged. The matrix has columns aligned in a vertical direction and rows aligned in a horizontal direction. Charge-transfer portions are formed on either side of the columns of said pixels. Transfer electrodes in said charge-transfer portions are formed to include a first transfer electrode formed of a first electrode layer and a second transfer electrode formed by electrically connecting the first electrode layer and a second electrode layer through a contact. The second transfer electrode being disposed in the vertical direction above the charge-transfer portion in a vicinity of the contact to decrease the width of the charge-transfer portions in the horizontal direction and increase the light receiving sensor portions in the vertical direction.
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申请公布号 |
US2010171857(A1) |
申请公布日期 |
2010.07.08 |
申请号 |
US20100724259 |
申请日期 |
2010.03.15 |
申请人 |
SONY CORPORATION |
发明人 |
KANBE HIDEO |
分类号 |
H01L27/148;H01L21/28;H01L27/146;H01L29/04;H04N5/335;H04N5/341;H04N5/355;H04N5/369;H04N5/372 |
主分类号 |
H01L27/148 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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