APPARATUS FOR CHEMICAL MECHANICAL POLISHING, MEMBRANE AND POLISHING HEAD FOR CHEMICAL MECHANICAL POLISHING

摘要

PURPOSE: A chemical and mechanical polishing device, a membrane and a polishing head used therefor are provided to uniformly produce a wafer by stably applying pressure to the edge of the wafer. CONSTITUTION: A chemical and mechanical polishing device comprises a support body and a circular membrane(40). The support body has multiple holes for applying pressure. The membrane is formed in the bottom of the support body and is in contact with a wafer. The edge parts(42a) of the membrane are thinner than the center part(42b) of the membrane.