| 摘要 |
PURPOSE: A liquid epoxy resin composition and a semiconductor device using thereof are provided to effectively remove bubbles generated during an under-filling process by decreasing a contacting angle. CONSTITUTION: A liquid epoxy resin composition for under-filling a semiconductor device contains an epoxy resin, a hardener, a curing accelerator, and an additive. The additive is an acrylic additive marked with chemical formula 1. In the chemical formula 1, R` is either hydrogen or methyl. R`` is an alkyl group, polyester, polyether, or amine salt. The average value of n is 10~100.
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