| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a sensor chip and a method of manufacturing the same protecting a circuit part for processing a signal from a sensing part and improving the assemblability, and to provide a pressure sensor. <P>SOLUTION: A sensing part 40a includes a pressure reference chamber 46, formed being sealed with a recessed part 41b for the reference chamber and one side surface 42a by sticking one side surface 41a of a first silicon substrate 41 and one side surface 42a of a second silicon substrate 42 together so that the recessed part 41b for the reference chamber and a strain gauge 44 are in proximity with each other. A signal corresponding to displacement of a diaphragm 47, based on a pressure difference between a reference pressure of the pressure reference chamber 46 and a pressure of a pressure medium, is input from the strain gauge 44 to a circuit part 45. A through-electrode 48 for extracting the signal from the circuit part 45 is formed on the other side surface 42b of the second silicon substrate 42. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
