| 摘要 |
PROBLEM TO BE SOLVED: To provide a small-sized ceramic board which reduces intervals of electrodes with a terminal electrode structure having high connection strength, as well as an electronic component using the ceramic board. SOLUTION: A multilayer ceramic board where active elements and passive elements are packaged on its top surface on one side is formed by lamination of a plurality of ceramic board layers, and it includes a surface layer terminal electrode composed of a surface layer via electrode and a metal plated layer adhered to its end surface, provided at least in a via hole of the ceramic board layer on the top surface on one side, and a via interconnection which connects the surface layer terminal electrode with an interconnection on the inner ceramic board layers. A via hole diameter of the surface layer terminal electrode connecting the active element is smaller than that of the surface layer terminal electrode connecting the passive element. COPYRIGHT: (C)2010,JPO&INPIT |
