| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component that is high in yield. Ž<P>SOLUTION: The method of manufacturing the electronic component includes the processes of: preparing a frame member 6 having a plurality of hole portions H and support members 7 inserted into the respective hole portions H; forming a laminate 4 in each hole portion H by laminating a film on each support member 7; and fabricating the electronic component through a heat treatment on the laminate 4. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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