Assembly for high-power light-emitting diode lamp, has lamp housing and high-output light-emitting diode chip that produces thermal power, where chip carrier extends into heat dissipating element

摘要

The assembly has a lamp housing (3) and high-output light-emitting diode chip (5) that produces thermal power. A chip carrier (2) extends into heat dissipating element. The partial surface of a side surface of the chip carrier is formed by heat dissipation. An independent claim is also included for a high-output light-emitting diode chip.