发明名称 Semiconductor device and method for fabricating the same
摘要 A semiconductor device includes: a semiconductor substrate; a source region and a drain region formed in the upper part of the semiconductor substrate so as to be spaced; a channel region formed in a part of the semiconductor substrate between the source region and the drain region; a first dielectric film formed on the channel region of the semiconductor substrate; a second dielectric film formed on the first dielectric film and having a higher permittivity than the first dielectric film; a third dielectric film formed on at least an end surface of the second dielectric film near the drain region out of end surfaces of the second dielectric film near the source and drain regions; and a gate electrode formed on the second dielectric film and the third dielectric film.
申请公布号 US7750396(B2) 申请公布日期 2010.07.06
申请号 US20060438385 申请日期 2006.05.23
申请人 PANASONIC CORPORATION 发明人 TAKAMI YOSHINORI
分类号 H01L29/76 主分类号 H01L29/76
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