发明名称 |
METHOD FOR FORMING METAL WIRING LAYER IN SEMICONDUCTOR MEMORY DEVICE |
摘要 |
PURPOSE: A metal wiring layer forming method of a semiconductor memory device is provided to control the increase of the contact resistance by forming a silicide on a bottom surface of a contact hole. CONSTITUTION: An inter-layer insulating film(120) is formed on a bottom conductive layer(110). A contact hole exposing a part of the bottom conductive layer is formed. A barrier layer(130) is formed on an inner wall of the contact hole. A metal layer(140a) is formed to have a constant thickness. The hard mask pattern is formed on the metal layer. A metal layer is patterned and the metal wiring layer connected with the bottom conductive layer is formed.
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申请公布号 |
KR20100076682(A) |
申请公布日期 |
2010.07.06 |
申请号 |
KR20080134809 |
申请日期 |
2008.12.26 |
申请人 |
HYNIX SEMICONDUCTOR INC. |
发明人 |
SEO, BO MIN;HONG, SEUNG HEE;CHO, JIK HO;PARK, GIL JAE |
分类号 |
H01L21/28 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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