| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition which gives a phenolic resin laminate excellent in heat resistance without deteriorating such characteristics as punchability and electrical characteristics, a prepreg obtained therefrom, and a paper base phenolic resin laminate excellent in heat resistance without deteriorating characteristics such as punchability and electrical characteristics. SOLUTION: The resin composition is used for forming a prepreg and contains: a novolak phenolic resin of which the binuclear components account for 15 wt.% or more; and a resol phenolic resin. The prepreg is obtained by impregnating a base paper with the resin composition. The paper base phenolic resin laminate is obtained by molding one or more plies of the prepreg. COPYRIGHT: (C)2004,JPO |
