| 摘要 |
A curable liquid epoxy resin composition comprising: (I) a liquid epoxy resin; (II) an acid anhydride; (III) a diorganosiloxane represented by the following general formula: A-R-(RSiO)RSi-R-A {where Rdesignates identical or different, substituted or unsubstituted univalent hydrocarbon groups, which are free of aliphatic unsaturated bonds; Rdesignates bivalent organic groups; ''A'' represents a siloxane residue radical expressed by the following average unit formula: (XRSiO)(SiO)(where Ris the same as defined above, X designates a single bond, a hydrogen atom, a group designated by R, an epoxy-containing alkyl group, or an alkoxysilylalkyl group; however, in one molecule at least one X should be represented by a single bond, and at least two groups designated by X should be represented by epoxy-containing alkyl groups; ''a'' is a positive number; ''b'' is a positive number; and a/b is a number ranging from 0.2 to 4); and ''n'' is an integer equal to or greater than 1}; and (IV) an inorganic filler, possesses excellent handleability and workability and that, when cured, forms a cured product of excellent adhesiveness in combination with low modulus of elasticity. |
