THERMOSETTING RESIN COMPOSITION FOR LIGHT REFLECTION, SUBSTRATE MADE THEREFROM FOR PHOTOSEMICONDUCTOR ELEMENT MOUNTING, PROCESS FOR PRODUCING THE SAME, AND PHOTOSEMICONDUCTOR DEVICE

摘要

A thermosetting resin composition for light reflection which is excellent in various properties required of substrates for photosemiconductor element mounting thereon, including optical properties and resistance to thermal discoloration, and which has excellent releasability in molding by the transfer molding method, etc. and can be continuously molded. Also provided are: a highly reliable substrate for photosemiconductor element mounting thereon made from the resin composition; a photosemiconductor device; and processes for efficiently producing these. The thermosetting resin composition for light reflection comprises an epoxy resin, a hardener, a hardening catalyst, an inorganic filler, a white pigment, an additive, and a release agent as major components. This composition gives a cured composition which has a light diffuse reflectance as measured with light having a wavelength of 400 nm of 80% or higher. In transfer molding, the thermosetting resin composition can be continuously molded over 100 cycles or more.