发明名称 LOW TEMPERATURE BONDING ELECTRONIC ADHESIVES
摘要 <p>Provided are adhesive compositions comprising a mixture of a maleimide terminated polyimide resin, a thermoplastic resin compatible with the maleimide terminated polyimide resin, a liquid rubber, and a thermally activated free radical curing agent. Various embodiments add one or more of a silane coupling agent, an ethylenically unsaturated compound with acid functionality, electrically conductive particles, and electrically conductive scrim. Methods of using the compositions also are provided.</p>
申请公布号 KR20100075906(A) 申请公布日期 2010.07.05
申请号 KR20107007870 申请日期 2008.09.09
申请人 3M INNOVATIVE PROPERTIES COMPANY 发明人 LARSON ERIC G.;ZENNER ROBERT L. D.;MURRAY CAMERON T.;SURA RAVI K.
分类号 C09J179/08;C09J7/02;C09J9/02;H01L21/58 主分类号 C09J179/08
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