METHOD FOR FABRICATING PRINTED CIRCUIT BOARD

摘要

PURPOSE: A printed circuit board manufacturing method is provided to conduct a circuit pattern arranged on first and second surfaces of an insulation layer by plating the conducting material in the via hole. CONSTITUTION: A first carrier(11) having a first circuit pattern(11a) and a second carrier(12) having a second circuit pattern(12a) are laminated on a first surface and a second surface, respectively. The first circuit pattern and the second circuit pattern are buried in the insulating layer. By selectively removing the first carrier and the insulation layer, a via hole is formed to exposed the second circuit pattern.