| 摘要 |
<p>Disclosed is a method for forming a circuit, wherein a circuit pattern making a conductive layer is formed on an insulating resin (11) making a first insulating layer, an insulating resin (13) making a second insulating layer is formed on the insulating resin (11) on which the circuit pattern is formed, a trench (14) is formed in the insulating resin (13) for exposing the circuit pattern, and the thus-formed trench (14) is filled with an electroless plating metal (15) by electroless plating.</p> |
