| 摘要 |
PURPOSE: A semiconductor wafer and a method for manufacturing the same are provided to prevent chipping defects of a wafer by maintaining edge profiles in curve shape after a back grinding process. CONSTITUTION: A first region(100) is located on the upper side of a wafer. The first region is a region to be a chip. A second region(200) is located on the lower side of the first region. The second region is polished during a back-grinding process. The edge profiles(101, 102) of the first region are curve shape. The lateral profile(103) of the first region is curve shape.
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