发明名称 WAFER ALIGNMENT DEVICE
摘要 PURPOSE: A wafer alignment device is provided to prevent damage to a wafer and a unit process by correcting the misalignment of the wafer when the wafer is accepted into a spread box. CONSTITUTION: A spray box comprises slots(151a). The slots are installed to be opposite to each other to receive a wafer therein. An alignment the both sides of the wafer received into the spray box to align the position of the wafer. The alignment is comprised of at least a pair of cylinder and a pair of louver. The cylinder is installed at both sides of the spray box and is movable. The louver aligns the wafer.
申请公布号 KR20100073564(A) 申请公布日期 2010.07.01
申请号 KR20080132277 申请日期 2008.12.23
申请人 DONGBU HITEK CO., LTD. 发明人 LEE, WOO SANG
分类号 H01L21/673;H01L21/68 主分类号 H01L21/673
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