| 摘要 |
PROBLEM TO BE SOLVED: To lessen an exposed portion of a film when supporting a wafer. SOLUTION: A wafer support device (30) which supports a wafer 20 in which a film (3) is adhered on the whole surface includes: a first tube member arranged at the circumference of a wafer (31); and a second tube member (32) arranged at the circumference of the first tube member. The film is bent to the first tube material side at the circumference of the first cylinder member, and is held between the first tube member and the second tube member, thereby to support the wafer. The second tube member may include a support member (33a) which extends into a radial direction interior and supports the end of the first tube member. Moreover, engagement parts (37, 38) which engage together may be provided to the outer circumference surface of the first tube member and the inner circumference surface of the second tube member. COPYRIGHT: (C)2010,JPO&INPIT |
