| 摘要 |
<p>PURPOSE: A circuit board and a manufacturing method thereof are provided to mount both sides of a circuit device by forming a first circuit pattern and a second circuit pattern on conductive foils of an upper substrate and a lower substrate. CONSTITUTION: First and second conductive foils are attached to the upper side and the lower side of an upper substrate(11). The first circuit pattern is formed on the first conductive foil. A bonding layer(13) is formed around the second conductive foil. Third and fourth conductive foils are attached to the upper side and the lower side of a lower substrate(12). The second circuit pattern is formed on the third conductive foil. An insulating layer is formed on the lower side of the lower substrate. A cavity(14) is formed on the upper substrate, the lower substrate, and the insulating layer. A through hole electrode is connected to the first circuit pattern and the second circuit pattern.</p> |
