发明名称 LIGHT-EMITTING DEVICE, LIGHT-EMITTING MODULE, AND METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE
摘要 <p>A light-emitting chip (22) is equipped with: a container (30) having a concave part (31); a first lead part (61) through a fourth lead part (64), provided to be exposed to the concave part (31); and a first blue LED through a fourth blue LED (74) mounted on the first lead part (61) through fourth lead part (64) which are exposed to the concave part (31). The container (30) is equipped with a first container part (40) that covers the region of the concave part (31) where the first lead part (61) through fourth lead part (64) are not exposed, and a second container part (50) that contacts first lead part (61) through fourth lead part (64) without being exposed to the concave part (31) and accommodates the first container part (40); in addition, the first container part (40) is formed of a material having higher light reflectivity than that of the second container part (50), and the second container part (50) is formed of a material having higher thermal conductivity than that of the first container part (40). Thus, a decrease in extraction efficiency for light emitted from a light-emitting element can be suppressed, and a rise in the temperature of the light-emitting element in response to the emission of light can be suppressed.</p>
申请公布号 WO2010073950(A1) 申请公布日期 2010.07.01
申请号 WO2009JP70991 申请日期 2009.12.16
申请人 SHOWA DENKO K. K.;TAKEI, TOMOYUKI;MIKI, HISAYUKI 发明人 TAKEI, TOMOYUKI;MIKI, HISAYUKI
分类号 H01L33/64 主分类号 H01L33/64
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