| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide electronic equipment for efficiently performing both cooling and heating of an electronic component. Ž<P>SOLUTION: The electronic equipment includes a substrate 2 having the electronic component 1 mounted on a top surface thereof, a heat dissipation unit arranged on the top surface side of the substrate 2, a heat conductive plate 4 interposed between the heat dissipation unit and electronic component 1, a heat conductive sheet 5 interposed between the heat conductive plate 4 and electronic component 1 to bring the top surface into contact with the backside of the heat conductive plate 4 and to bring the backside into contact with the top surface of the electronic component 1, and a heater 6 for heating the electronic component 1. The heat conductive plate 4 is driven by a driving device 7 to reciprocally move between a contact state in which the top surface of the heat conductive plate 4 is in contact with the backside of the heat dissipation unit and a separate state in which the top surface of the heat conductive plate 4 is separate from the backside of the heat dissipation unit, and the heat conductive member 5 freely expands and contracts as the heat conductive plate reciprocally moves. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
