发明名称 ON-CHIP TRANSFORMER BALUN STRUCTURES
摘要 An electronic device includes a first winding having a first port and a second port. The first winding formed in a first metal layer. A second winding has a third port and a fourth port. The second winding includes a plurality of segments formed in the first metal layer. The second plurality of winding segments are connected by a bridge formed in a second metal layer. The first and second ports of the first winding are connected to the inner-portion of the first winding.
申请公布号 US2010164667(A1) 申请公布日期 2010.07.01
申请号 US20080347569 申请日期 2008.12.31
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 HO-HSIANG CHEN
分类号 H01F21/00;H01F5/00 主分类号 H01F21/00
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