发明名称 |
ON-CHIP TRANSFORMER BALUN STRUCTURES |
摘要 |
An electronic device includes a first winding having a first port and a second port. The first winding formed in a first metal layer. A second winding has a third port and a fourth port. The second winding includes a plurality of segments formed in the first metal layer. The second plurality of winding segments are connected by a bridge formed in a second metal layer. The first and second ports of the first winding are connected to the inner-portion of the first winding.
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申请公布号 |
US2010164667(A1) |
申请公布日期 |
2010.07.01 |
申请号 |
US20080347569 |
申请日期 |
2008.12.31 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
HO-HSIANG CHEN |
分类号 |
H01F21/00;H01F5/00 |
主分类号 |
H01F21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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