发明名称 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To form an alignment mark finely on a backside irradiation type CMOS image sensor. SOLUTION: For example, a contact hole 21b penetrating an Si epitaxial layer 10 where a unit cell is formed is formed in the Si epitaxial layer 10. Its inner wall is oxidized to form a thin insulating film 21c having a substantially uniform film thickness. Low-resistance polysilicon is buried in the contact hole 21b with the insulating film 21c interposed to form a contact layer 21a, thereby forming a backside extraction electrode 21 serving as an alignment mark. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010147230(A) 申请公布日期 2010.07.01
申请号 JP20080322519 申请日期 2008.12.18
申请人 TOSHIBA CORP 发明人 KOIKE HIDETOSHI;KOYAMA HIROSUKE
分类号 H01L27/146;H01L21/3205;H01L23/52;H01L27/14 主分类号 H01L27/146
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