| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for electric insulation having both curability at low temperature in a short time and thermal resistance. SOLUTION: This thermosetting resin composition comprises (A) a polymeric component having at least two polymerizable substituents, (B) a compound having at least one polymerizable substituent, and (C) a living polymerization agent [or (C) the living polymerization agent and (D) an organic peroxide and/or organic azo compound] for curing the composition. A boron compound is preferable as the component (C), and an organic peroxide is preferable as the component (D). COPYRIGHT: (C)2010,JPO&INPIT
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