发明名称 WOODEN FLOORING
摘要 PROBLEM TO BE SOLVED: To provide wooden flooring which can reduce a dimensional change due to humidity and can restrain a particle board from convexly warping due to heating from a floor-heating heating element when the wooden flooring of the particle board is used for a floor heating system. SOLUTION: The wooden flooring 1 is laid over the floor-heating heating element 20, and has the particle board 2 wherein a surface layer 3 and a reverse layer 5 in which chips made up of mainly small pieces 11 are stuck by an adhesive agent 12 are provided on both sides of a core layer 4 in which chips made up of mainly large pieces 10 are stuck by the adhesive agent 12. A moistureproof sheet 6 is pasted to the surface layer 3 and the reverse layer 5 of the particle board 2. The particle board 2 faces the reverse layer 5 to the floor heating-heating element 20 and makes the thickness t<SB>2</SB>of the reverse layer 5 lower than the thickness t<SB>1</SB>of the surface layer 3. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010144460(A) 申请公布日期 2010.07.01
申请号 JP20080324653 申请日期 2008.12.19
申请人 PANASONIC ELECTRIC WORKS CO LTD 发明人 NAKAGAWA MASAHIRO;SUZUKI SHINICHI
分类号 E04F15/04 主分类号 E04F15/04
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