| 摘要 |
PURPOSE: A measurement method of a jitter is provided to increase a test effect of a semiconductor by measuring the jitter characteristics of a semiconductor device at a wafer level and a package level. CONSTITUTION: The cycle of a frequency which is outputted from the semiconductor device of a wafer level and a package level is repeatedly measured(S1). The maximum cycle and a minimum cycle is calculated among the measured cycles(S2). The difference value between the minimum cycle and maximum cycle is calculated(S3). Jitter characteristics of the semiconductor is confirmed according to the difference value(S4).
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