发明名称 RESIN SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a resin substrate processing apparatus that enables an operator to easily and correctly determined the quality as to whether a device is defective. SOLUTION: The resin substrate processing apparatus includes a holding table for holding a substrate on which devices are formed on regions segmented by lattice-like separation schedule lines, respectively; a processing means for processing the resin substrate held on the holding table; and an image pickup means for picking up an image of the devices. The processing apparatus further includes: an illuminating means for illuminating the devices in image pickup of the devices; and a determining means used to determine whether each device is defective, based on the image picked up by the image pickup means. The illumination means includes at least either a red illumination apparatus or a blue illumination apparatus. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010147113(A) 申请公布日期 2010.07.01
申请号 JP20080320373 申请日期 2008.12.17
申请人 DISCO ABRASIVE SYST LTD 发明人 UEHARA TAKESHI;SATO MASAFUMI
分类号 H01L21/301;H01L23/12 主分类号 H01L21/301
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