| 摘要 |
PURPOSE: A physical vapor deposition device is provided to prevent particles on a film by reducing stress which is applied in the film according to a temperature change. CONSTITUTION: A physical vapor deposition device comprises an exterior wall(110), a shield(130), a heater(140), a clamp(150), a target(160), and a cooling water line(120). The exterior wall divides the space of the chamber. The shield protects the exterior wall. The heater heats a wafer. The clamp fixes the wafer. The target emits atom using a plasma and evaporates on the upper side of the wafer. The cooling water line covering shield is formed inside the exterior wall.
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