SOLDER SUPPORTING LOCATION FOR SOLAR MODULES AND SEMICONDUCTOR DEVICE

摘要

The invention relates to a soldered connection between an outer surface (23) of a semiconductor device (10), connected to a substrate (12) by means of an adhesive layer (14), and a connector (24) in the form of a strip. In order that tensile forces acting on the connector do not cause the semiconductor device to be detached from the substrate or the adhesive layer, it is proposed that from the outer surface (23) of the semiconductor device (10) there extends a supporting location (26, 28), which consists of solderable material and makes contact with the outer surface (23) by way of a contact surface A, in or on which the connector (24) is soldered while maintaining a distance a from the outer surface (33) where a = 10 µm, and/or that the distance b between the edge of the contact surface between the supporting surface and the outer surface and the entry of the connector into the supporting location or the beginning of contact between them is b = 50 µm.