发明名称 |
BUMP STRUCTURE WITH MULTIPLE LAYERS AND METHOD OF MANUFACTURE |
摘要 |
<p>A bump structure with multiple layers may include a first layer electrically connected to a protective substrate hermetically packaging a base substrate, the first layer allowing the base substrate and the protective substrate to be spaced apart from each other at a predetermined distance; and a second layer electrically connected to the first layer, the second layer being eutectically bonded on a surface of the base substrate. The first layer may have a melting point higher than a eutectic temperature of the second layer and the base substrate. When using a bump structure with multiple layers, it is possible to secure a space in which a micro-structure such as a microelectromechanical systems (MEMS) device on a base substrate may be driven. Further, it is possible to prevent a contact between adjacent structures or electrodes from being generated due to diffusion of a bonding material in a hermetical packaging process.</p> |
申请公布号 |
EP2201831(A2) |
申请公布日期 |
2010.06.30 |
申请号 |
EP20080840712 |
申请日期 |
2008.10.17 |
申请人 |
BARUN ELECTRONICS CO., LTD. |
发明人 |
LEE, SANG CHUL;KIM, SUNG-WOOK |
分类号 |
B81C1/00;H01L23/04;H05K5/06 |
主分类号 |
B81C1/00 |
代理机构 |
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代理人 |
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